The COB LED display module uses advanced technology by directly mounting LED chips onto the PCB, creating a flat and compact surface. It offers higher pixel density, better protection against dust and moisture, improved heat dissipation, and a slimmer design—ideal for high-definition indoor displays.
Advantages of COB LED display Module
COB packaging technology involves directly mounting LED chips onto a printed circuit board (PCB). Both Flip-Chip COB and Front-Mounted COB create a strong connection between the chip and the PCB, improving device performance and reliability while allowing for more compact and thinner designs.
Flip-chip COB
Front-mounted COB
Higher density leads to clearer visual quality
The COB LED display module directly solders LED chips onto the PCB, creating a flat and uniform surface that enhances screen brightness and uniformity. With no physical barriers between the chips, it allows for higher pixel density, resulting in finer images, richer colors, and more realistic visual effects.
Excellent protection performance
The COB LED display screen uses integrated packaging, with its surface cured and coated with polymer materials to effectively block dust from entering. The module is fully sealed, giving it excellent waterproof performance. Since the LED chips are entirely enclosed within a protective layer and lack any protruding lamp bead structure, they are highly resistant to damage from collisions or vibrations during transport, installation, and daily use.
Efficient heat dissipation
By achieving close contact between the chip and the substrate, thermal resistance is reduced, allowing heat to transfer quickly to the substrate and dissipate efficiently. This effectively lowers the operating temperature of the LED chip. Compared to traditional SMD packaging, COB technology consumes less power to reach the same brightness, produces less heat, and reduces heat dissipation stress, further enhancing cooling performance.
COB LED Display Aging Test
